Cleaning system is applied in the wet chemical process of IC and electronic components. It is used to remove the organic (Photo-resist), particle, metal, native oxide and contamination of quartz and plastic, etc. The various models of manual, semiautomatic or completely automatic control and largely improved ratios of eligible products are exactly matching the different requirement of customers.
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| Specifications︰ |
² Wafer Size: 75～200 mm
² Process: RCA and User Setting
² Carrier: 50 Wafers Above
² Move: Manual
² Control: TIMER
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| Advantages︰ |
² Cost-Effective high performance
² High reliability and stability
² High throughout
² Compact footprint
² Proven uptime
² In-line metrology
² Could pre-programmed over 20 processes
² Multi-process operation simultaneous
² Fully automation intelligent controller
² High reliability monitoring system
² High productivity
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